Safely removes solder in all application requiring Type ROL0 rosin flux.
BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes.
- Pure copper braid.
- 1,5m spool packaged in ESD-safe static dissipative bobbins.
- Noncorrosive ultra purity Type R rosin flux (ROL0).
- Minimizes the risk of heat damage to the board.
- Will not leave ionic contamination on the boards.
Specifications:
- MIL-F-14256 F type R flux
- NASA-STD-8739.3 Soldered Electrical Connections
- DOD-STD-883E, Method 2022
- AINSI/IPC J STD-004, Type ROL0
